TheIPC®Compliant Footprint Wizarddialog

Summary

The IPC Compliant Footprint Wizard dialog creates IPC-compliant component footprints. Rather than working from footprint dimensions, the IPC Compliant Footprint Wizard uses dimensional information from the component itself in accordance with the standards released by the IPC.

Instead of requiring you to enter the properties of the pads and tracks that are used to define the footprint, the Wizardtakes the actual component dimensions as its inputs. Based on the formulas developed for the IPC-7351 standard, the Wizardthen generates the footprint using standard Altium Designer objects, such as pads and tracks.

For more information about creating component footprints, see the Creating the PCB Footprint page.

This dialog is compliant with Revision B of the IPC standard 7351 - Generic Requirements for Surface Mount Design and Land Pattern Standard. IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007).

Access

TheIPC Compliant Footprint Wizard dialog is launched by clicking Tools »IPC Compliant Footprint Wizard from a PCB Library (*.PcbLib) document.

The dialog can only be accessed if the IPC Footprint Generator extension is installed as part of your Altium Designer installation. This extension is installed by default, but if it is inadvertently uninstalled, the extension can be found on the Purchasedtab of the Extensions & Updates page, located by clicking the

 drop-down then choosing Extensions and Updates. Hover over the icon, then click

 to download the extension. Altium Designer must be restarted to complete installation. If at any time you want to uninstall the extension, find the extension on the Installedtab of the Extensions & Updates page then click

 to uninstall. Altium Designer must be restarted to complete the uninstall process.

Wizard Navigation

Click Cancel to close the IPC Compliant Footprint Wizard.

Click Back to navigate to the previous screen.

Click Next to navigate to the next screen.

Click Finishto close the IPC Compliant Footprint Wizard.

Finishis available on any page of the Wizard after selecting the component type. If you click Finishbefore completing the entire Wizard, the footprint will be created using the system defaults for the component type you selected.

Selecting the Component Type

Choose the family of components for which you want to create a footprint on the Select Component Type page.

Click on the component type desired. The preview region on the right-hand side of the Wizard dynamically changes to show the currently selected component and also states the type of packages that are allowed to be generated.

The following table lists the component types and packages that are supported in the Wizard.

Name

Description

Included Packages

BGA

Ball Grid Array

BGA, CGA

BQFP

Bumpered Quad Flat Pack

BQFP

CAPAE

Electrolytic Aluminum Capacitor

CAPAE

CFP

Ceramic Dual Flat Pack - Trimmed and formed Gullwing Leads

CFP

Chip Array

Chip Array

Chip Array

DFN

Dual Flat No-lead

DFN

CHIP

Chip Components, 2-Pins

Capacitor, Inductor, Resistor

CQFP

Ceramic Quad Flat Pack - Trimmed and formed Gullwing Leads

CQFP

DPAK

Transistor Outline

DPAK

LCC

Leadless Chip Carrier

LCC

LGA

Land Grid Array

LGA

MELF

MELF Components, 2-Pins

Diode, Resistor

MOLDED

Molded Components, 2-Pins

Capacitor, Inductor, Diode

PLCC

Plastic Leaded Chip Carrier, Square - J Leads

PLCC

PQFN

Pullback Quad Flat No-Lead

PQFN

PQFP

Plastic Quad Flat Pack

PQFP, PQFP Exposed Pad

PSON

Pullback Small Outline No-Lead

PSON

QFN

Quad Flat No-Lead

QFN, LLP

QFN-2ROW

Quad Flat No-Lead, 2 Rows, Square

Double Row QFN

SODFL

Small Outline Diode, Flat Lead

SODFL

SOIC

Small Outline Integrated Package, 1.27mm Pitch - Gullwing Leads

SOIC, SOIC Exposed Pad

SOJ

Small Outline Package - J Leads

SOJ

SON

Small Outline Non-Lead

SON, SON Exposed Pad

SOP, TSOP

Small Outline Package - Gullwing Leads

SOP, TSOP, TSSOP

SOT143/343

Small Outline Transistor

SOT143, SOT343

SOT223

Small Outline Transistor

SOT223

SOT23

Small Outline Transistor

3-Leads, 5-Leads, 6-Leads

SOT89

Small Outline Transistor

SOT89

SOTFL

Small Outline Transistor, Flat Lead

3-Leads, 5-Leads, 6-Leads

WIRE WOUND

Precision Wire Wound Inductor, 2-Pins

Inductor

Tips

Paste Masks are split into small fills for packages with a large thermal pad (sized 2.1mm x 1.6mm, or larger).

For packages involving gullwing leads, pads are trimmed to prevent them from otherwise extending under the package's body.

For small packages having a large central thermal pad, the peripheral pads are trimmed to ensure required clearance between the pads in accordance with the IPC Standard.

When pad trimming is applied, a warning is displayed within the dialog.

All Wizard measurement dimensions are required to be entered as metric (mm) units.

Preview Region

On the following pages for each component type, the Previewregion dynamically updates to show new location, size, etc., for several settings. In the Previewregion, you can click

 or 

 to toggle between 2D and 3D preview images.

3D STEP Models

Previewing 3D STEP Models

If desired, you can see a preview of the 3D STEP model before generating the model. Click Generate STEP Model Preview on anypage in the Wizardafter selecting the component type to see a preview of the 3D STEP model in the Previewregion.

The default setting for the files that are created when 3D STEP models are generated is Embedded STEP files. If these default settings are correct for your needs, you can click Finishto exit the IPC® Compliant Footprint Wizard and generate the 3D STEP model.

The subsequent pages of the Wizardchange depending upon the component type you selected. Find your component type in the following list then click on the link to access the information regarding that component type.

BGA

BGA Package Dimensions

Use the BGA Package Dimensionspage to enter the required package values for Overall Dimensions and Ball Information.

BGA Package Layout Options

Use the BGA Package Layout Options page to define the basic ball layout by adding or removing balls and changing the grid type.

The Add Balls to Cavity Border selections are only accessible if Selectively Depopulated is selected from the drop-down.

Select the grid type from the drop-down. Selections include Plain Grid or Staggered Grid.

Select the matrix type from the drop-down. Selections include Full Matrix, Perimeter, Thermally Enhanced, and Selectively Depopulated.

If Full Matrix is selected, none of the other options of the region are available.

If Perimeteris selected, only Cavity Size is accessible for updating.

If Thermally Enhancedis selected, only Cavity Sizeand Size of Thermal Arrayare accessible for updating.

If Selectively Depopulatedis selected, all areas, including Add Balls to Cavity Border are accessible for updating.

BGA Pads Diameter

The BGA Pads Diameter page is used to specify the pad diameter of the footprint. The pad diameter is determined using the following methods:

Select Use Maximum Material Condition (MMC) to use the largest pad size (IPC recommended) for the given ball diameter.

Select Use Least Material Condition (LMC)to use the smallest pad size (IPC recommended) for the given ball diameter.

Select Reduce from nominal ball diameter (B) in percent by to define a percentage reduction of the ball diameter then enter the desired percentage value in the textbox.

The pad diameter will be  - this statement is dynamically updated to show the current value based on the above selections.

BGA Silkscreen Dimensions

The BGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width.

Enable the Use calculated silkscreen dimensions to use the displayed values or disable the checkbox and enter the desired new values in the textboxes.

BGA Courtyard, Assembly and Component Body Information

The BGA Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable the Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

BQFP

BQFP Package Overall Dimensions

Use the BQFP Package Overall Dimensions page to set the package values.

Enter the Lead Span Range(Minimumand Maximum), Maximum Height, and Minimum Standoff Height using the textboxes to the right of each option. Use the diagram to the right as a guide for each measurement.

Set the Pin 1 Location by selecting either Corner of Left Side orCenter of Top Side. The Previewregion is dynamically updated to show the Pin location.

BQFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the BQFP Package Pin Dimensionspage.

Enter the Lead Width Range, Lead Length Range, Pitch, Body Length Range, and Number of pins.

BQFP Package Heel Spacing

Set the desired heel spacing values on the BQFP Package Heel Spacing page. The minimum heel spacing is calculated by subtracting twice the Maximum Lead Length Range from the Minimum Body Width that were set on the previous page. The maximum heel spacing is calculated by adding the tolerance on the inner distance between the heels of the opposing rows of leads to the minimum heel spacing.

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum.

BQFP Solder Fillets

Set the required solder fillet values on theBQFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

BQFP Component Tolerances

Enter the required values for component tolerances on the BQFP Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges based upon experience.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and/or Tolerance on the width of the component leads.

BQFP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the BQFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

BQFP Footprint Dimensions

The BQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions (X and Y), and Pad Spacing. Select the correct Pad Shape, either Roundedor Rectangular.

BQFP Silkscreen Dimensions

The BQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width.

BQFP Courtyard, Assembly and Component Body Information

The BQFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable the Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for Courtyard, Assembly, and Component Body by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information.

CAPAE

CAPAE Component Package Dimensions

Enter the required values for the package dimensions on the CAPAE Component Package Dimensionspage.

Enter the Lead Span Range, Body Length Range,Body Width Range, Lead Length Range, Lead Width Range, Diameter Range, and Maximum Height.

CAPAE Component Package Heel Spacing

Set the desired heel spacing values on the CAPAE Component Package Heel Spacing page. The maximum heel spacing is calculated by adding the tolerance on the inner distance between the heels of the opposing rows of leads to the minimum heel spacing.

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum.

CAPAE Component Solder Fillets

Set the required solder fillet values on the CAPAE Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

CAPAE Component Component Tolerances

Enter the required values for component tolerances on the CAPAE Component Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges based upon experience.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and/or Tolerance on the width of the component leads.

CAPAE Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the CAPAE Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

CAPAE Component Footprint Dimensions

The CAPAE Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions (X and Y), and Pad Spacing.

CAPAE Component Silkscreen Dimensions

The CAPAE Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter new desired values.

CAPAE Component Courtyard, Assembly and Component Body Information

The CAPAE Component Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

CFP

CFP Package Overall Dimensions

Use the CFP Package Overall Dimensions page to set the package values.

Enter the Maximum Body Width, Maximum Body Length, Maximum Height, Minimum Standoff Height, andAbsent Pinsusing the textboxes to the right of each option. Use the diagram to the right as a guide for each measurement.

CFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the CFP Package Pin Dimensionspage.

Enter the Lead Width Range, Pitch, and Number of pins. Enable Use calculated values to accept the displayed values or disable the checkbox and enter new values for Lead Span Rangeand Lead Length Range.

CFP Package Heel Spacing

Set the desired heel spacing values on the CFP Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum.

CFP Solder Fillets

Set the required solder fillet values on the CFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

CFP Component Tolerances

Enter the required values for component tolerances on the CFP Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

CFP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the CFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

CFP Footprint Dimensions

The CFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions (X and Y), Pad Spacing. Select either Roundedor Rectangularfor the Pad Shape.

CFP Silkscreen Dimensions

The CFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

CFP Courtyard, Assembly and Component Body Information

The CFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

Chip Array

Chip Array Package Dimensions

Use the ChipArray Package Dimensions page to set the package values.

Enter the Body Span Range(s) and Maximum Height. Use the drop-down to select the Hull side type: Flat, Concave, ConvexE, or ConvexS.

Chip Array Package Pin Dimensions

Enter the required values for the package pin dimensions on the ChipArray Package Pin Dimensionspage.

Enter the Lead Width Range,Lead Length Range, Pitch, and Number of pins.

Chip Array Package Heel Spacing

Set the desired heel spacing values on the ChipArray Package Heel Spacing page.

Enable the Use calculated values checkbox to use the value currently displayed or enter a new value directly in the textboxes for Smax.

Chip Array Solder Fillets

Set the required solder fillet values on the ChipArray Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Chip Array IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the ChipArray IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

Chip Array Footprint Dimensions

The ChipArray Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions (X and Y), Pad Spacing. Select either Roundedor Rectangularfor the Pad Shape.

Chip Array Courtyard, Assembly and Component Body Information

The ChipArray Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

Chip Array Silkscreen Dimensions

The ChipArray Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

DFN

DFN Package Overall Dimensions

Use the DFN Package Overall Dimensions page to set the package values.

Enter the Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. Use the drop-down to select the Package Type: DFN 2-Lead, DFN 3-Lead, or DFN 4-Lead.

DFN Package Pin Dimensions

Enter the required values for the package pin dimensions on the DFN Package Pin Dimensionspage.

Enter the Lead Width Range(s),Lead Length Range(s), and Pitch(es).

DFN Solder Fillets Dimensions

Set the required solder fillet values on the DFN Solder Fillets Dimensions page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use Default value to use the values displayed or you can adjust it to suit your specific needs.

Use the Board Density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. Enter the Peripheryvalue in the textbox.

DFN Tolerance Dimensions

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the DFN Tolerance Dimensions page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

DFN Footprint Dimensions

The DFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

DFN Silkscreen Dimensions

The DFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

DFN Mechanical Dimensions

The DFN Mechanical Dimensions page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

CHIP

Chip Component Package Dimensions

Enter the required values for the package dimensions on the Chip Component Package Dimensionspage.

Enter the Body Length Range,Body Width Range, Bandwidth Range, and Maximum Height. Use the drop-down to select the package type: Chip Capacitor, Chip Inductor, Chip Resistor, or Chip Diode.

Select thePolarity Pin Location. Choices include: None, Pin 1, andPin 2.

Chip Component Package Heel Spacing

Set the desired heel spacing values on the Chip Component Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

Chip Component Solder Fillets

Set the required solder fillet values on the Chip Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Chip Component Component Tolerances

Enter the required values for component tolerances on the Chip Component Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

Chip Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Chip Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

Chip Component Footprint Dimensions

The Chip Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Chip Component Silkscreen Dimensions

The Chip Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Chip Component Courtyard, Assembly and Component Body Information

The Chip Component Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

CQFP

CQFP Package Overall Dimensions

Use the CQFP Package Overall Dimensions page to set the package values.

Enter the Body Range, Maximum Height, and Minimum Standoff Height.

Select either Corner of Left Side or Center of Top Side for the Pin 1 Location.

CQFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the CQFP Package Pin Dimensionspage.

Enter the Lead Width Range(s),Pitch, and Number of pins.

Enable Use calculated valuesto use the values displayed or disable the option and enter the desired values for Lead Span Range(s)and Lead Length Range(s).

CQFP Package Heel Spacing

Set the desired heel spacing values on the CQFP Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

CQFP Solder Fillets

Set the required solder fillet values on the CQFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

CQFP Component Tolerances

Enter the required values for component tolerances on the CQFP Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

CQFP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the CQFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

CQFP Footprint Dimensions

The CQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

CQFP Silkscreen Dimensions

The CQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

CQFP Courtyard, Assembly and Component Body Information

The CQFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

DPAK

DPAK Package Overall Dimensions

Use the DPAK Package Overall Dimensions page to set the package values.

Enter the Length Range, Maximum Height, Minimum Standoff Height,Maximum Body Width,Maximum Body Length, andNumber of pins (including tab).

Use the drop-down to select the Tab Designator.

Enable the Pin is trimmedcheckbox to denote trimmed pins for each pad designator in the table.

DPAK Package Pin Dimensions

Enter the required values for the package pin dimensions on the DPAK Package Pin Dimensionspage.

Enter the Lead Width Range(s),Lead Length Range(s), Tab Width Range(s), Tab Length Range(s), Tab Overhang, and Pitch(es).

DPAK Package Heel Spacing

Set the desired heel spacing values on the DPAK Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

DPAK Solder Fillets

Set the required solder fillet values on the DPAK Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet(s), and Side Fillet(s), the Use default values option must be disabled. Enter the new values directly in the textboxes.

DPAK Component Tolerances

Enter the required values for component tolerances on the DPAK Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

DPAK IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the DPAK IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

DPAK Footprint Dimensions

The DPAK Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

DPAK Silkscreen Dimensions

The DPAK Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

DPAK Courtyard, Assembly and Component Body Information

The DPAK Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

LCC

Leadless Chip Carrier Package Dimensions

Use the Leadless Chip Carrier Package Dimensionspage to enter the required package values for Body Width Range, Body Length Range, Maximum Height, andMinimum Package Height. Set thePin 1 Locationby selecting either Side of Dor Center of E.

Leadless Chip Carrier Package Pin Dimensions

Enter the required values for the package pin dimensions on the Leadless Chip Carrier Package Pin Dimensionspage.

Leadless Chip Carrier Package Toe Spacing

Use the Leadless Chip Carrier Package Toe Spacingpage to enter the required toe spacing values. Enable Use calculated values to accept the displayed values or disable the checkbox and enter the desired values.

Leadless Chip Carrier Solder Fillets

Set the required solder fillet values on the Leadless Chip Carrier Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Heel Fillet (JH Min), Toe Fillet (JT Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Leadless Chip Carrier Component Tolerances

Enter the required values for component tolerances on the Leadless Chip Carrier Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

Leadless Chip Carrier IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Leadless Chip Carrier IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

Leadless Chip Carrier Footprint Dimensions

The Leadless Chip Carrier Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

Leadless Chip Carrier Silkscreen Dimensions

The Leadless Chip Carrier Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Leadless Chip Carrier Courtyard, Assembly and Component Body Information

The Leadless Chip Carrier Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

LGA

LGA Package Dimensions

Use the LGA Package Dimensionspage to enter the required package values for Overall Dimensions and Lead Information.

LGA Package Layout Options

Use the LGA Package Layout Options page to define the basic ball layout by adding or removing balls and changing the grid type.

The Add Balls to Cavity Border selections are only accessible if Selectively Depopulated is selected from the drop-down.

Select the grid type from the drop-down. Selections include Plain Grid or Staggered Grid.

Select the matrix type from the drop-down. Selections include Full Matrix, Perimeter, Thermally Enhanced, and Selectively Depopulated.

If Full Matrix is selected, none of the other options of the region are available.

If Perimeteris selected, only Cavity Size is accessible for updating.

If Thermally Enhancedis selected, only Cavity Sizeand Size of Thermal Arrayare accessible for updating.

If Selectively Depopulatedis selected, all areas, including Add Balls to Cavity Border, are accessible for updating.

LGA Pads Diameter

The LGA Pads Diameter page is used to specify the pad diameter of the footprint. Enable Use default values to accept the displayed Peripheryvalue or disable and enter new values.

Select either Roundedor Rectangularfor Pad Shape.

LGA Silkscreen Dimensions

The LGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

LGA Courtyard, Assembly and Component Body Information

The LGA Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

MELF

MELF Component Package Dimensions

Use the MELF Component Package Dimensionspage to enter the required package values for Body Length Range,Body Width Range, and Bandwidth Range. Use the drop-down to select the Package Type: MELF Diode or MELF Resistor. Set the Cathode Locationby selecting either Pin 1or Pin 2.

MELF Component Package Heel Spacing

Set the desired heel spacing values on the MELF Component Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

MELF Component Solder Fillets

Set the required solder fillet values on the MELF Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

MELF Component Component Tolerances

Enter the required values for component tolerances on the MELF Component Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

MELF Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the MELF Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

MELF Component Footprint Dimensions

The MELF Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

MELF Component Silkscreen Dimensions

The MELF Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

MELF Component Courtyard, Assembly and Component Body Information

The MELF Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

MOLDED

Molded Component Package Dimensions

Use the Molded Component Package Dimensionspage to enter the required package values for Body Length Range,Body Width Range, Lead Length Range, Lead Width Range,and Maximum Height. Use the drop-down to select the Package Type: Molded Capacitor, Molded Inductor,or Molded Diode. Set the Polarity Pin Locationby selecting None, Pin 1or Pin 2.

Molded Component Package Toe Spacing

Set the desired heel spacing values on the Molded Component Package Toe Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

Molded Component Solder Fillets

Set the required solder fillet values on the Molded Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Molded Component Component Tolerances

Enter the required values for component tolerances on the Molded Component Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

Molded Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Molded Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

Molded Component Footprint Dimensions

The Molded Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Molded Component Silkscreen Dimensions

The Molded Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Molded Component Courtyard, Assembly and Component Body Information

The Molded Component Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

PLCC

PLCC Square Package Overall Dimensions

Use the PLCC Square Package Overall Dimensionspage to enter the required package values for Body Length Range(s),Maximum Height, and Minimum Standoff Height. Set the Pin 1 Locationby selecting either Corner of Left Sideor Center of Top Side.

PLCC Square Package Pin Dimensions

Enter the required values for the package pin dimensions on the PLCC Square Package Pin Dimensionspage.

PLCC Square Package Toe Spacing

Set the desired heel spacing values on the PLCC Square Package Toe Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

PLCC Square Solder Fillets

Set the required solder fillet values on the PLCC Square Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

PLCC Square Component Tolerances

Enter the required values for component tolerances on the PLCC Square Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

PLCC Square IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PLCC Square IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

PLCC Square Footprint Dimensions

The PLCC Square Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

PLCC Square Silkscreen Dimensions

The PLCC Square Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PLCC Square Courtyard, Assembly and Component Body Information

The PLCC Square Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

PQFN

PQFN Package Overall Dimensions

Use the PQFN Package Overall Dimensionspage to enter the required package values for Body Span Range(s),Maximum Height, Minimum Standoff Height, and Chamfered corner. Set the Pin 1 Locationby selecting either Side of Dor Center of E.

PQFN Package Pin Dimensions

Enter the required values for the package pin dimensions on the PQFN Package Pin Dimensionspage.

PQFN Package Power Pad Dimensions

Enter the required values for the power pad dimensions on the PQFN Package Power Pad Dimensionspage. Enable Add Power and Ground Bars to access Width, Power Bar Lengths, Ground Bar Lengths, Power Bar Spacings, and Ground Bar Spacings. Enter any required changes in the textboxes.

PQFN Package Heel Spacing

Set the desired heel spacing values on the PQFN Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for SE Minimum, SE Maximum, SD Minimum, and SD Maximum.

PQFN Solder Fillets

Set the required solder fillet values on the PQFN Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

Enter the desired value for Periphery.

PQFN Component Tolerances

Enter the required values for component tolerances on the PQFN Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

PQFN IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PQFN IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

PQFN Footprint Dimensions

The PQFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

PQFN Silkscreen Dimensions

The PQFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PQFN Courtyard, Assembly and Component Body Information

The PQFN Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

PQFP

PQFP Package Overall Dimensions

Use the PQFP Package Overall Dimensionspage to enter the required package values for Lead Span Range(s),Maximum Height, and Minimum Standoff Height. Set the Pin 1 Locationby selecting either Side of Dor Center of E.

PQFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the PQFP Package Pin Dimensionspage.

PQFP Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the PQFP Package Thermal Pad Dimensionspage. Enable Add Thermal Pad to access the Thermal Pad Rangeoptions and enter any required changes in the textboxes.

PQFP Package Heel Spacing

Set the desired heel spacing values on the PQFP Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for SE Minimum, SE Maximum, SD Minimum, and SD Maximum.

PQFP Solder Fillets

Set the required solder fillet values on the PQFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

PQFP Component Tolerances

Enter the required values for component tolerances on the PQFP Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

PQFP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PQFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

PQFP Footprint Dimensions

The PQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

PQFP Silkscreen Dimensions

The PQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PQFP Courtyard, Assembly and Component Body Information

The PQFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

PSON

PSON Package Dimensions

Use the PSON Package Dimensionspage to enter the required package values for Body Span Range(s),Maximum Height, Minimum Standoff Height, and Pin Count.

PSON Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the PSON Package Thermal Pad Dimensionspage. Enter any required changes in the textboxes.

PSON Solder Fillets

Set the required solder fillet values on the PSON Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

Enter the value for Peripheryin the textbox.

PSON Component Tolerances

Enter the required values for component tolerances on the PSON Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

PSON IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PSON IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

PSON Footprint Dimensions

The PSON Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor disable and enter new values for Pad Dimensions and Pad Spacing.

PSON Footprint Paste Fill Dimensions

The PSON Footprint Paste Fill Dimensions page displays the inferred footprint paste fill dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor disable and enter new values for Paste Fill Dimensions.

PSON Silkscreen Dimensions

The PSON Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PSON Courtyard, Assembly and Component Body Information

The PSON Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

QFN

QFN Package Overall Dimensions

Use the QFN Package Overall Dimensionspage to enter the required package values for Body Span Range(s),Maximum Height, Minimum Standoff Height, and Chamfered corner. Set the Pin 1 Locationby selecting either Side of Dor Center of E.

QFN Package Pin Dimensions

Enter the required values for the package pin dimensions on the QFN Package Pin Dimensionspage.

QFN Package Power Pad Dimensions

Enter the required values for the power pad dimensions on the QFN Package Power Pad Dimensionspage. Enable Add Power and Ground Bars to access Width, Power Bar Lengths, Ground Bar Lengths, Power Bar Spacings, and Ground Bar Spacings. Enter any required changes in the textboxes.

QFN Package Heel Spacing

Set the desired heel spacing values on the QFN Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for SE Minimum, SE Maximum, SD Minimum, and SD Maximum.

QFN Solder Fillets

Set the required solder fillet values on the QFN Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

QFN Component Tolerances

Enter the required values for component tolerances on the QFN Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

QFN IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the QFN IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

QFN Footprint Dimensions

The QFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

QFN Silkscreen Dimensions

The QFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

QFN Courtyard, Assembly and Component Body Information

The QFN Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

QFN-2ROW

QFN-2ROW Package Overall Dimensions

Use the QFN-2ROW Package Overall Dimensionspage to enter the required package values for Body Span Range(s),Maximum Height, Minimum Standoff Height, and Total number of pins. Enable Calculate number of pins in rows to use the displayed values or disable and enter new Number of pins values.

QFN-2ROW Package Pin Dimensions

Enter the required values for the package pin dimensions on the QFN-2ROW Package Pin Dimensionspage.

Enter the Lead Width Range,Lead Length Range, Pitch, and Row Pitch.

Enable Add Thermal Pad to add a thermal pad then enter the Thermal Pad Range values.

QFN-2ROW Package Heel Spacing

Set the desired heel spacing values on the QFN-2ROW Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S1 Minimumand S1 Maximum.

QFN-2ROW Solder Fillets

Set the required solder fillet values on the QFN-2ROW Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

QFN-2ROW Component Tolerances

Enter the required values for component tolerances on the QFN-2ROW Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

QFN-2ROW IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the QFN-2ROW IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

QFN-2ROW Footprint Dimensions

The QFN-2ROW Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

QFN-2ROW Courtyard, Assembly and Component Body Information

The QFN-2ROW Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SODFL

SODFL Package Dimensions

Use the SODFL Package Dimensionspage to enter the required package values for Body Width Range,Body Length Range, Maximum Height, Lead Width Range, Lead Length Range, and Lead Span Range.

SODFL Package Heel Spacing

Set the desired heel spacing values on the SODFL Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SODFL Solder Fillets

Set the required solder fillet values on the SODFL Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SODFL Component Tolerances

Enter the required values for component tolerances on the SODFL Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SODFL IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SODFL IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SODFL Footprint Dimensions

The SODFL Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SODFL Silkscreen Dimensions

The SODFL Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SODFL Courtyard, Assembly and Component Body Information

The SODFL Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOIC

SOIC Package Dimensions

Use the SOIC Package Dimensionspage to enter the required package values for Overall Dimensions and Pin Information.

SOIC Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the SOIC Package Thermal Pad Dimensionspage. Enable Add Thermal Pad if required and enter any changes for Thermal Pad Range(s).

SOIC Package Heel Spacing

Set the desired heel spacing values on the SOIC Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOIC Solder Fillets

Set the required solder fillet values on the SOIC Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOIC Component Tolerances

Enter the required values for component tolerances on the SOIC Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOIC IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOIC IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOIC Footprint Dimensions

The SOIC Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

SOIC Silkscreen Dimensions

The SOIC Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOIC Courtyard, Assembly and Component Body Information

The SOIC Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOJ

SOJ Package Dimensions

Use the SOJ Package Dimensionspage to enter the required package values for Overall Dimensions and Pin Information.

SOJ Package Heel Spacing

Set the desired heel spacing values on the SOJ Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOJ Solder Fillets

Set the required solder fillet values on the SOJ Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOJ Component Tolerances

Enter the required values for component tolerances on the SOJ Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOJ IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOJ IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOJ Footprint Dimensions

The SOJ Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

SOJ Silkscreen Dimensions

The SOJ Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOJ Courtyard, Assembly and Component Body Information

The SOJ Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SON

SON Package Dimensions

Use the SON Package Dimensionspage to enter the required package values for Body Span Range(s),Maximum Height, Minimum Standoff Height, and Pin Count.

SON Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the SON Package Thermal Pad Dimensionspage. Enter any required changes for Lead Width Range,Lead Length Range,Pitch,Thermal Pad Ranges (s), andLead Height.

SON Package Heel Spacing

Set the desired heel spacing values on the SON Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for Minimumand Maximum.

SON Solder Fillets

Set the required solder fillet values on the SON Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SON Component Tolerances

Enter the required values for component tolerances on the SON Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SON IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SON IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SON Footprint Dimensions

The SON Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SON Footprint Paste Fill Dimensions

The SON Footprint Paste Fill Dimensions page displays the inferred footprint paste fill dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor disable and enter new values for Paste Fill Dimensions.

SON Silkscreen Dimensions

The SON Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SON Courtyard, Assembly and Component Body Information

The SON Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOP/TSOP

SOP/TSOP Package Dimensions

Use the SOP/TSOP Package Dimensions page to enter values for Overall Dimensionsand Pin Information.

SOP/TSOP Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the SOP/TSOP Package Thermal Pad Dimensionspage. Enable Add Thermal Pad if required then enter any desired changes in Thermal Pad Range(s).

SOP/TSOP Package Heel Spacing

Set the desired heel spacing values on the SOP/TSOP Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOP/TSOP Solder Fillets

Set the required solder fillet values on the SOP/TSOP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOP/TSOP Component Tolerances

Enter the required values for component tolerances on the SOP/TSOP Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOP/TSOP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOP/TSOP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOP/TSOP Footprint Dimensions

The SOP/TSOP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Select either Roundedor Rectangularfor Pad Shape.

SOP/TSOP Silkscreen Dimensions

The SOP/TSOP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOP/TSOP Courtyard, Assembly and Component Body Information

The SOP/TSOP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOT143/343

SOT143/343 Package Overall Dimensions

Use the SOT143/343 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. Use the drop down to select the correct Package Type: SOT143 or SOT343.

To specify the Pin Order, use  and  to move the selected Pad Designator up or down in the list.

Large Pin Options can be specified by selecting Single large pin or Top left and top right pins are large. If Single large pin is selected, use the drop down to specify the location: Top left, Bottom left, Bottom right, orTop right. The Preview region is dynamically updated.

SOT143/343 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT143/343 Package Pin Dimensionspage.

SOT143/343 Package Heel Spacing

Set the desired heel spacing values on the SOT143/343 Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOT143/343 Solder Fillets

Set the required solder fillet values on the SOT143/343 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT143/343 Component Tolerances

Enter the required values for component tolerances on the SOT143/343 Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOT143/343 IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT143/343 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOT143/343 Footprint Dimensions

The SOT143/343 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SOT143/343 Silkscreen Dimensions

The SOT143/343 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT143/343 Courtyard, Assembly and Component Body Information

The SOT143/343 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOT223

SOT223 Package Overall Dimensions

Use the SOT223 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height.

SOT223 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT223 Package Pin Dimensionspage.

SOT223 Package Heel Spacing

Set the desired heel spacing values on the SOT223 Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOT223 Solder Fillets

Set the required solder fillet values on the SOT223 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT223 Component Tolerances

Enter the required values for component tolerances on the SOT223 Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOT223 IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT223 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOT223 Footprint Dimensions

The SOT223 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SOT223 Silkscreen Dimensions

The SOT223 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT223 Courtyard, Assembly and Component Body Information

The SOT223 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOT23

SOT23 Package Overall Dimensions

Use the SOT23 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. Use the drop down to select the correct Package Type: SOT23 3-Lead, SOT23 5-Lead, or SOT23 6-Lead.

To specify the Pin Order, use  and  to move the selected Pad Designator up or down in the list.

SOT23 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT23 Package Pin Dimensionspage.

SOT23 Package Heel Spacing

Set the desired heel spacing values on the SOT23 Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOT23 Package Round Off

Use the SOT23 Package Round Off page to set the round off value. Enable Use Calculated Value to use the value currently displayed or enter a new value directly in the textbox for Round Off Pitch.

SOT23 Solder Fillets

Set the required solder fillet values on the SOT23 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT23 Component Tolerances

Enter the required values for component tolerances on the SOT23 Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOT23 IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT23 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOT23 Footprint Dimensions

The SOT23 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SOT23 Silkscreen Dimensions

The SOT23 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT23 Courtyard, Assembly and Component Body Information

The SOT23 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOT89

SOT89 Package Overall Dimensions

Use the SOT89 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, and Maximum Height.

Enable Reverse Pin Order to reverse the pin order. The Previewregion is dynamically updated.

SOT89 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT89 Package Pin Dimensionspage.

SOT89 Solder Fillets

Set the required solder fillet values on the SOT89 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT89 Component Tolerances

Enter the required values for component tolerances on the SOT89 Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOT89 IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT89 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOT89 Footprint Dimensions

The SOT89 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SOT89 Silkscreen Dimensions

The SOT89 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT89 Courtyard, Assembly and Component Body Information

The SOT89 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

SOTFL

SOTFL Package Overall Dimensions

Use the SOTFL Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, and Maximum Height. Use the drop down to select the correct Package Type: SOTFL 3-Lead, SOTFL 5-Lead, or SOTFL 6-Lead.

To specify the Pin Order, use  and  to move the selected Pad Designator up or down in the list.

SOTFL Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOTFL Package Pin Dimensionspage.

SOTFL Package Heel Spacing

Set the desired heel spacing values on the SOTFL Package Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

SOTFL Solder Fillets

Set the required solder fillet values on the SOTFL Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOTFL Component Tolerances

Enter the required values for component tolerances on the SOTFL Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

SOTFL IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOTFL IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

SOTFL Footprint Dimensions

The SOTFL Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

SOTFL Silkscreen Dimensions

The SOTFL Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOTFL Courtyard, Assembly and Component Body Information

The SOTFL Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

WIRE WOUND

Precision Wire Wound Package Dimensions

Use the Precision Wire Wound Package Dimensions page to set the required values for Body Length Range, Body Width Range, Lead Length Range,Lead Width Range, and Maximum Height.

Set the Polarity Pin Location by selecting either None, Pin 1, or Pin 2.

Precision Wire Wound Heel Spacing

Set the desired heel spacing values on the Precision Wire Wound Heel Spacing page.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimumand S Maximum.

Precision Wire Wound Solder Fillets

Set the required solder fillet values on the Precision Wire Wound Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Previewregion is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Precision Wire Wound Component Tolerances

Enter the required values for component tolerances on the Precision Wire Wound Component Tolerances page.

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges.

If the displayed values are correct for your current situation, enable the Use calculated component tolerancestextbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabledthen enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads.

Precision Wire Wound IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Precision Wire Wound IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Modifying the IPC Tolerances may result in PCB footprints that are not IPC compliant.

Precision Wire Wound Footprint Dimensions

The Precision Wire Wound Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint valuesor enter new values for Pad Dimensions and Pad Spacing.

Precision Wire Wound Silkscreen Dimensions

The Precision Wire Wound Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for theSilkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Precision Wire Wound Courtyard, Assembly and Component Body Information

The Precision Wire Wound Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layerand selecting the desired mechanical layer.

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layerand selecting the desired mechanical layer.

Choosing the Footprint Name and Description

TheFootprint Description page is used to name and describe your new footprint. Altium Designer uses the information you input in the Wizardto suggest a name and description. Enable Use suggested values to use the Nameand Description the system has entered. Enter any desired changes directly in the textboxes.

Selecting the Footprint Destination

Use the Footprint Destination page to select the location for the newly-created footprint to be stored.

SelectExisting PcbLib File if you want the footprint stored in an existing PCB Library file. You can enter the file directly in the textbox or use the

 to open a dialog to search for the desired file.

SelectNew PcbLib File if you want to store the footprint in a new PCB Library file. Enter the name of the new PCB Library file in the textbox. The system will append the new library file name with the extension .PcbLib.

Select Current PcbLib File to store the footprint in the displayed PCB Library file.

Enable Produce 3D/STEP model to generate a 3D STEP model.

If you have a valid 'MCAD Co-Designer - SOLIDWORKS(R)' license, you can choose to save the model as file type Parasolid. Click the drop-down to the right of Format then select Parasolid. The file shown in the External File text box is now a *.x_t file.  This is the name and location of the file that will be saved.

Select eitherEmbedded (default) or External File. SelectExternal File to save your 3D STEP model as an external file. The default file type is STEP and the file name appears in the External File text box with *.step as the file extension. If desired, click

 to browse and select the folder in which to save your generated 3D STEP model.

Closing the Wizard

Click Finishto close the Wizard.